8.8 Events, 2020-2026
L1 Timeline
Filter by grade, region, or stage; select a mark to bring its row or card into view.
| Date | Event | Region | Stage | Source, accessed | Grade |
|---|---|---|---|---|---|
| 2020-07-07 | Soitec to make POI wafers in volume for Qualcomm RF filters Soitec SA; Qualcomm | EU | wafer | eeNews Europe, 2020-07-07, 2026-10-24 | T |
| 2021-03-31 | Fujitsu Optical Components ships its one millionth coherent lithium-niobate modulator Fujitsu Optical Components Ltd. (FOC) | JP | product | Fujitsu Optical Components press release, 2021-03-31 (archived copy, read in full), 2026-10-25 | F |
| 2022-03-28 | Murata completes acquisition of Resonant (XBAR on thin LN) Murata Manufacturing; Resonant Inc. | JP US | other | Murata news, 2022-03-29, 2026-10-24 | F |
| 2022-12 | CHIPX 6" TFLN pilot line: construction began CHIPX (Wuxi Photonic Chip Research Institute, Shanghai Jiao Tong University) | CN | foundry | C114, 2025-06-09 (CHIPX), 2026-10-24 | T |
| 2023-09 | Anpai Optoelectronics completes an 8-inch TFLN line in Wuhan (reporter claim) Anpai Optoelectronics; Jiufengshan Laboratory | CN | foundry | Yicai via Sina, 2024-08-27 (Anpai, Jiufengshan), 2026-10-24 | T |
| 2024 | Jingzheng: funding of "several hundred million CNY" at end-2024 Jinan Jingzheng Electronics Co., Ltd. (NANOLN) | CN | wafer | Economic Herald via 10jqka, 2026-06-29, 2026-10-24 | T |
| 2024 | Lightium: CHF 2.67 M Innosuisse grant in 2024 Lightium AG; Innosuisse | EU | foundry | eeNews Europe, 2024-09-20 (Lightium), 2026-10-24 | T/V |
| 2024-03 | Jiufengshan Lab: first 8-inch Si-photonic TFLN wafer (reporter claim) Jiufengshan Laboratory; Anpai Optoelectronics | CN | wafer | Yicai via Sina, 2024-08-27 (Anpai, Jiufengshan), 2026-10-24 | T |
| 2024-05 | Nature paper on LT PICs for volume manufacturing (EPFL/SIMIT): start of TFLT EPFL; SIMIT | EU CN | other | Nature 629, 784-790 (2024), DOI 10.1038/s41586-024-07369-1 (RePEc abstract), 2026-10-24 | F |
| 2024-09 | CHIPX 6-inch TFLN pilot line goes into operation (C114 report; month uncertain) CHIPX (Wuxi Photonic Chip Research Institute, Shanghai Jiao Tong University) | CN | foundry | C114, 2025-06-09 (CHIPX), 2026-10-24 | T |
| 2024-09-20 | Lightium US$7 M seed reported Lightium AG; Vsquared Ventures; Lakestar | EU | foundry | eeNews Europe, 2024-09-20 (Lightium), 2026-10-24 | T |
| 2024-09-24 | HyperLight US$37 M Series B led by Summit Partners HyperLight Corporation; Summit Partners | US | funding | Lightwave, 2024-09-24, 2026-10-24 | T |
| 2024-11-13 | QCi announces first TFLN foundry order Quantum Computing Inc. (QCi) | US | foundry | Lightwave, 2024-11-18 (QCi), 2026-10-24 | T |
| 2025-04-07 | AFR at OFC 2025: TFLN 130 GBd CDM in volume shipment, 400 G/lane TFLN chip debut Advanced Fiber Resources (Zhuhai) Ltd. (AFR) | CN | product | AFR news, 2025-04-07 (OFC 2025), 2026-10-24 | F/V |
| 2025-05-13 | CCRAFT spun out of CSEM. Targets 12 M chips/yr by 2030 CCRAFT SA; CSEM SA | EU | foundry | optics.org, 2025-05-13, 2026-10-24 | T/V |
| 2025-06-05 | AdvR joins Hawthorn Photonics (Covesion's group) AdvR, Inc.; Hawthorn Photonics; Covesion Ltd. | US EU | other | Optica corporate member news, 2025-06-05, 2026-10-24 | F |
| 2025-06-09 | CHIPX reports its first 6-inch TFLN wafer CHIPX (Wuxi Photonic Chip Research Institute, Shanghai Jiao Tong University) | CN | foundry | C114, 2025-06-09 (CHIPX), 2026-10-24 | T |
| 2025-06-23 | ELENA: first Europe-made commercial LNOI (150 mm) ELENA consortium; CSEM SA; CEA-Leti; Soitec SA; VPIphotonics; ETH Zurich; Vanguard Automation; Thales; III-V Lab; Rosenberger; L-up | EU | wafer | PIC Magazine, 2025-06-23 (ELENA), 2026-10-24 | T |
| 2025-06-25 | Soitec to supply 150 mm LNOI to CCRAFT. 200 mm wafer shown Soitec SA; CCRAFT SA | EU | wafer | optics.org, 2025-06-25, 2026-10-24 | T |
| 2025-07-22 | Q.ANT EUR 62 M Series A Q.ANT GmbH; Cherry Ventures; UVC Partners; imec.xpand; TRUMPF | EU | funding | Evertiq, 2025-07-22 (Q.ANT), 2026-10-24 | T |
| 2025-07-30 | Xanadu + HyperLight: <2 dB/m, about 20 mdB switch Xanadu Quantum Technologies; HyperLight Corporation | US | other | The Quantum Insider, 2025-07-30, 2026-10-24 | T/V |
| 2025-10-01 | AFR at ECOC 2025: 400 G/lane chip for 1.6T/3.2T Advanced Fiber Resources (Zhuhai) Ltd. (AFR) | CN | product | AFR news, 2025-10-01 (ECOC 2025), 2026-10-24 | F/V |
| 2025-12-30 | TDG Holding filing: target of 2.10 M piezo + bonded wafers/yr by 2029-12 TDG Holding Co., Ltd.; Qinghe Jingyuan | CN | wafer | TDG Holding (600330), Investor Relations Activity Record, 2026-06-03, 2026-10-24 | F |
| 2026 | Jingzheng: strategic investment from Nanjing Venture Capital Group (2026) Jinan Jingzheng Electronics Co., Ltd. (NANOLN); Nanjing Venture Capital Group | CN | wafer | Economic Herald via 10jqka, 2026-06-29, 2026-10-24 | T |
| 2026-01-19 | Ligentec + X-FAB: 200 mm TFLN-on-SiN / TFLN-on-SOI scaling Ligentec SA; X-FAB Silicon Foundries | EU | foundry | X-FAB news, 2026-01-19, 2026-10-24 | F |
| 2026-03-11 | HyperLight + UMC + Wavetek: volume foundry on 6" and 8" HyperLight Corporation; United Microelectronics Corporation (UMC); Wavetek | US TW | foundry | UMC press release, 2026-03-12 (content via TrendForce, iConnect007), 2026-10-24 | T/C |
| 2026-03-16 | OFC 2026: HyperLight 1.6T-DR8 TFLN reference module at 20 W, with TFC HyperLight Corporation; Suzhou TFC Optical Communication Co., Ltd. | US CN | product | Business Wire China (HyperLight 1.6T-DR8), 2026-03-17, 2026-10-24 | F/V |
| 2026-04 | Jingzheng: strategic investment from Shandong Hi-Speed fund Jinan Jingzheng Electronics Co., Ltd. (NANOLN); Shandong Hi-Speed | CN | wafer | Economic Herald via 10jqka, 2026-06-29, 2026-10-24 | T |
| 2026-06-03 | TDG Holding IR: expects LN modulators to be mainstream for 3.2T+ TDG Holding Co., Ltd. | CN | wafer | TDG Holding (600330), Investor Relations Activity Record, 2026-06-03, 2026-10-24 | F |
| 2026-06-17 | Shanghai Securities News: Niobao Series C in progress. Nanzhi Xincai Pre-A >CNY 100 M. Xili round led by Lenovo Capital. Jingzheng preparing IPO Jiangsu Niobao Optoelectronics Technology Co., Ltd.; Nanzhi Xincai Technology Co., Ltd.; Xili Photonics; Lenovo Capital; Jinan Jingzheng Electronics Co., Ltd. (NANOLN) | CN | funding | Shanghai Securities News, 2026-06-17, 2026-10-24 | T |
| 2026-06-18 | HyperLight US$80 M Series C led by MediaTek. Investors include UMC Capital, Jabil, Foxconn, EDBI, CDIB-TEN, QIA HyperLight Corporation; MediaTek; UMC Capital; Jabil; Foxconn; EDBI; CDIB-TEN; QIA | US | funding | Summit Partners (HyperLight Series C), 2026-06-18, 2026-10-24 | F |
| 2026-07-02 | CCRAFT raises US$7.8 M (QBIT Capital lead). Target 2,000 wafers/month by 2030 CCRAFT SA; QBIT Capital | EU | foundry | CSEM press, 2026-07-02, 2026-10-24 | F/T |
- 2020-07-07
Soitec to make POI wafers in volume for Qualcomm RF filters
Soitec SA; Qualcomm
TEU · wafereeNews Europe, 2020-07-07, accessed 2026-10-24
- 2021-03-31
Fujitsu Optical Components ships its one millionth coherent lithium-niobate modulator
Fujitsu Optical Components Ltd. (FOC)
FJP · productFujitsu Optical Components press release, 2021-03-31 (archived copy, read in full), accessed 2026-10-25
- 2022-03-28
Murata completes acquisition of Resonant (XBAR on thin LN)
Murata Manufacturing; Resonant Inc.
FJP US · otherMurata news, 2022-03-29, accessed 2026-10-24
- 2022-12
CHIPX 6" TFLN pilot line: construction began
CHIPX (Wuxi Photonic Chip Research Institute, Shanghai Jiao Tong University)
TCN · foundryC114, 2025-06-09 (CHIPX), accessed 2026-10-24
- 2023-09
Anpai Optoelectronics completes an 8-inch TFLN line in Wuhan (reporter claim)
Anpai Optoelectronics; Jiufengshan Laboratory
TCN · foundryYicai via Sina, 2024-08-27 (Anpai, Jiufengshan), accessed 2026-10-24
- 2024
Jingzheng: funding of "several hundred million CNY" at end-2024
Jinan Jingzheng Electronics Co., Ltd. (NANOLN)
TCN · waferEconomic Herald via 10jqka, 2026-06-29, accessed 2026-10-24
- 2024
Lightium: CHF 2.67 M Innosuisse grant in 2024
Lightium AG; Innosuisse
T/VEU · foundryeeNews Europe, 2024-09-20 (Lightium), accessed 2026-10-24
- 2024-03
Jiufengshan Lab: first 8-inch Si-photonic TFLN wafer (reporter claim)
Jiufengshan Laboratory; Anpai Optoelectronics
TCN · waferYicai via Sina, 2024-08-27 (Anpai, Jiufengshan), accessed 2026-10-24
- 2024-05
Nature paper on LT PICs for volume manufacturing (EPFL/SIMIT): start of TFLT
EPFL; SIMIT
FEU CN · otherNature 629, 784-790 (2024), DOI 10.1038/s41586-024-07369-1 (RePEc abstract), accessed 2026-10-24
- 2024-09
CHIPX 6-inch TFLN pilot line goes into operation (C114 report; month uncertain)
CHIPX (Wuxi Photonic Chip Research Institute, Shanghai Jiao Tong University)
TCN · foundryC114, 2025-06-09 (CHIPX), accessed 2026-10-24
- 2024-09-20
Lightium US$7 M seed reported
Lightium AG; Vsquared Ventures; Lakestar
TEU · foundryeeNews Europe, 2024-09-20 (Lightium), accessed 2026-10-24
- 2024-09-24
HyperLight US$37 M Series B led by Summit Partners
HyperLight Corporation; Summit Partners
TUS · fundingLightwave, 2024-09-24, accessed 2026-10-24
- 2024-11-13
QCi announces first TFLN foundry order
Quantum Computing Inc. (QCi)
TUS · foundryLightwave, 2024-11-18 (QCi), accessed 2026-10-24
- 2025-04-07
AFR at OFC 2025: TFLN 130 GBd CDM in volume shipment, 400 G/lane TFLN chip debut
Advanced Fiber Resources (Zhuhai) Ltd. (AFR)
F/VCN · productAFR news, 2025-04-07 (OFC 2025), accessed 2026-10-24
- 2025-05-13
CCRAFT spun out of CSEM. Targets 12 M chips/yr by 2030
CCRAFT SA; CSEM SA
T/VEU · foundryoptics.org, 2025-05-13, accessed 2026-10-24
- 2025-06-05
AdvR joins Hawthorn Photonics (Covesion's group)
AdvR, Inc.; Hawthorn Photonics; Covesion Ltd.
FUS EU · otherOptica corporate member news, 2025-06-05, accessed 2026-10-24
- 2025-06-09
CHIPX reports its first 6-inch TFLN wafer
CHIPX (Wuxi Photonic Chip Research Institute, Shanghai Jiao Tong University)
TCN · foundryC114, 2025-06-09 (CHIPX), accessed 2026-10-24
- 2025-06-23
ELENA: first Europe-made commercial LNOI (150 mm)
ELENA consortium; CSEM SA; CEA-Leti; Soitec SA; VPIphotonics; ETH Zurich; Vanguard Automation; Thales; III-V Lab; Rosenberger; L-up
TEU · waferPIC Magazine, 2025-06-23 (ELENA), accessed 2026-10-24
- 2025-06-25
Soitec to supply 150 mm LNOI to CCRAFT. 200 mm wafer shown
Soitec SA; CCRAFT SA
TEU · waferoptics.org, 2025-06-25, accessed 2026-10-24
- 2025-07-22
Q.ANT EUR 62 M Series A
Q.ANT GmbH; Cherry Ventures; UVC Partners; imec.xpand; TRUMPF
TEU · fundingEvertiq, 2025-07-22 (Q.ANT), accessed 2026-10-24
- 2025-07-30
Xanadu + HyperLight: <2 dB/m, about 20 mdB switch
Xanadu Quantum Technologies; HyperLight Corporation
T/VUS · otherThe Quantum Insider, 2025-07-30, accessed 2026-10-24
- 2025-10-01
AFR at ECOC 2025: 400 G/lane chip for 1.6T/3.2T
Advanced Fiber Resources (Zhuhai) Ltd. (AFR)
F/VCN · productAFR news, 2025-10-01 (ECOC 2025), accessed 2026-10-24
- 2025-12-30
TDG Holding filing: target of 2.10 M piezo + bonded wafers/yr by 2029-12
TDG Holding Co., Ltd.; Qinghe Jingyuan
FCN · waferTDG Holding (600330), Investor Relations Activity Record, 2026-06-03, accessed 2026-10-24
- 2026
Jingzheng: strategic investment from Nanjing Venture Capital Group (2026)
Jinan Jingzheng Electronics Co., Ltd. (NANOLN); Nanjing Venture Capital Group
TCN · waferEconomic Herald via 10jqka, 2026-06-29, accessed 2026-10-24
- 2026-01-19
Ligentec + X-FAB: 200 mm TFLN-on-SiN / TFLN-on-SOI scaling
Ligentec SA; X-FAB Silicon Foundries
FEU · foundryX-FAB news, 2026-01-19, accessed 2026-10-24
- 2026-03-11
HyperLight + UMC + Wavetek: volume foundry on 6" and 8"
HyperLight Corporation; United Microelectronics Corporation (UMC); Wavetek
T/CUS TW · foundryUMC press release, 2026-03-12 (content via TrendForce, iConnect007), accessed 2026-10-24
- 2026-03-16
OFC 2026: HyperLight 1.6T-DR8 TFLN reference module at 20 W, with TFC
HyperLight Corporation; Suzhou TFC Optical Communication Co., Ltd.
F/VUS CN · productBusiness Wire China (HyperLight 1.6T-DR8), 2026-03-17, accessed 2026-10-24
- 2026-04
Jingzheng: strategic investment from Shandong Hi-Speed fund
Jinan Jingzheng Electronics Co., Ltd. (NANOLN); Shandong Hi-Speed
TCN · waferEconomic Herald via 10jqka, 2026-06-29, accessed 2026-10-24
- 2026-06-03
TDG Holding IR: expects LN modulators to be mainstream for 3.2T+
TDG Holding Co., Ltd.
FCN · waferTDG Holding (600330), Investor Relations Activity Record, 2026-06-03, accessed 2026-10-24
- 2026-06-17
Shanghai Securities News: Niobao Series C in progress. Nanzhi Xincai Pre-A >CNY 100 M. Xili round led by Lenovo Capital. Jingzheng preparing IPO
Jiangsu Niobao Optoelectronics Technology Co., Ltd.; Nanzhi Xincai Technology Co., Ltd.; Xili Photonics; Lenovo Capital; Jinan Jingzheng Electronics Co., Ltd. (NANOLN)
TCN · fundingShanghai Securities News, 2026-06-17, accessed 2026-10-24
- 2026-06-18
HyperLight US$80 M Series C led by MediaTek. Investors include UMC Capital, Jabil, Foxconn, EDBI, CDIB-TEN, QIA
HyperLight Corporation; MediaTek; UMC Capital; Jabil; Foxconn; EDBI; CDIB-TEN; QIA
FUS · fundingSummit Partners (HyperLight Series C), 2026-06-18, accessed 2026-10-24
- 2026-07-02
CCRAFT raises US$7.8 M (QBIT Capital lead). Target 2,000 wafers/month by 2030
CCRAFT SA; QBIT Capital
F/TEU · foundryCSEM press, 2026-07-02, accessed 2026-10-24
L2 Counts
| Stage | CN | US | EU | JP | TW | All |
|---|---|---|---|---|---|---|
| wafer | 6 | 3 | 9 | |||
| foundry | 4 | 2 | 5 | 1 | 11 | |
| product | 3 | 1 | 1 | 4 | ||
| funding | 1 | 2 | 1 | 4 | ||
| other | 1 | 3 | 2 | 1 | 4 |
Stage from the event tags (foundry, then wafer, then product, then funding; everything else other). Region from the tags: CN, US, EU (Europe and Switzerland), JP, TW.
L3 The event file
- Fields per event:
date,title,organizations,tags,grade, and citations withurlandaccessed. The same records are served at /api/v1/events/industry.json. - Default view: grades F, V, T. T/C marks an event read only through trade-press coverage because the primary page returned an error; it is shown with its grade printed. C-graded events are not listed.
- Dates at month or year precision are drawn at the middle of that month or year.